Contact Supplier

You Might Also Like

Loading...
Quick Change Diamond Resin Polish Pads for HTC Floor Grinder pictures & photos
Quick Change Diamond Resin Polish Pads for HTC Floor Grinder pictures & photos
Quick Change Diamond Resin Polish Pads for HTC Floor Grinder pictures & photos
Quick Change Diamond Resin Polish Pads for HTC Floor Grinder pictures & photos
Quick Change Diamond Resin Polish Pads for HTC Floor Grinder pictures & photos
  • Quick Change Diamond Resin Polish Pads for HTC Floor Grinder
  • Quick Change Diamond Resin Polish Pads for HTC Floor Grinder
  • Quick Change Diamond Resin Polish Pads for HTC Floor Grinder
  • Quick Change Diamond Resin Polish Pads for HTC Floor Grinder
  • Quick Change Diamond Resin Polish Pads for HTC Floor Grinder
Standard: HTC Fitting
Shape: HTC Fitting
Bonding Agent: Resin Binder
Grit: 36/50/100/200/400/800/1500/3000
Bond: Soft, Medium, Hard
Segment′s Size: 64*43*10mm
Customization:

You Might Also Like

Loading...

Send your message to this supplier

*From:
*To:
avatar Mr. Charlie Wong
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now